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Okano ICT Model AT-01 Series

Okano AT-01 Introduction

Okano AT-01 Feature

Okano AT-01 Specification

 

Okano AT-01 ICT - Machine Features

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Auto - Test
Auto testing begin with user manual press down buttons and auto press up after test completed.

In addition, it improves the work efficiency and minimizing the false rejects during test by system auto retry function for those failure components.
 

 

Data  Test

It provides 3 kinds of Screens View display (Select Graphic View) in Menu. The measured value of the selected step is indicated with graph display.

The location of the selected component also indicated in the display for easy finding purpose.

 

 

Excel Data Compatibility

It provides Data Compatibility between System Test Data and Excel Data.

Test Data is easily transportable between System Test Data area and Excel data area by simple "Copy" and "Paste" function

 

 

Mode, Range Test & Auto Generation function

It automatically generate the correct test mode and range for the designated component listed in the System Test Data.

It makes test program generation much quicker and less error and reduce the time needed for test program generation.

 

Various Graphic Display function

Failure components are indicated on the graphic display for easy finding and locating of the components.

 

Auto Guard Pin

Auto guard pin function auto generate the  most suitable Guard Pin automatically for all components on PCB.

 

 

Password Protection

It prevents unauthorized modification of the test program data.

3 user level are provided for ease of system control :- "Operator", "Technician", "Engineer"

 

 

 

 

 

Self Test

Measurement board and relay board diagnostics check are provided to help isolation and identify system failure.

 

Bar Code Editor

It provides easy management and report information of the board status by reading the serial No. of PCB with Bar Code reader.

 

 

Network Remote Control

Network provides high quality control and management efficiency for the production.

It provides real time data information and control over the production lines.

 

 

 

 

 

 

FrameScan & DeltaScan

Frame Scan & Delta Scan are developed by Teradyne co. in America, and these are mainly used to test the problem happen to PCB manufacturing process such as cold soldering and resistive solder joints of IC etc. Recently, the spread of SMT IC has increased and high densification is proceeding to improve the package from DIP to PGA, BGA and CSP more and more. AT-01 is featured to have high speed, reliability and low-cost corresponding to technological aggress, which FrameScan & DeltaScan are applied.
 

FrameScan

Excels in testing connectors and sockets

Very fast test generation

No device functionality information required

Precise diagnostics to the pin

Tests not often influenced by board topology

 

DeltaScan

In order to test whether or not IC assembly on PCB is accurate, Delta Scan tests the variation of DC current through Protect diode of each pin. For the OFF state of PCB power source, certain 2 pins on device always indicate the equivalent circuit as shown.

 

Delta Scan's Features

No fixture hardware required

Predictable fault coverage

No device package constraints

Detects several fault classes, including cold solder joints

Most effective on large digital devices

High repeatability

Fast execution and Accurate diagnostics

Complements other Vectorless techniques

Gray code or vector tests

* Fault class coverage : Open pin, blown bond wires, blown drivers, blown diodes, Misoriented devices, single power/ground pins

 

Superior Test Coverage

Measurement coverage

FrameScan

DeltaScan

Digital IC

V

V

Analog& Hybrid IC

V

 

BGA

 

V

Connector, Socket

V

 

Flip Chip & COB

 

V

Cold Soldering

 

V

BUS Device

V

 

Reverse Insertion
of Condenser

V

 

 

 

Boundary-Scan Test

Boundary-scan, as defined by the IEEE Std. 1149.1 standard, is an integrated method for testing interconnects on printed circuit boards that is implemented at the IC level. The inability to test highly complex and dense printed circuit boards using traditional in-circuit testers and bed of nail fixtures was already evident in the mid eighties. Due to physical space constraints and loss of physical access to fine pitch components and BGA devices, fixturing cost increased dramatically while fixture reliability decreased at the same time.

 

In the 1980s, the Joint Test Action Group (JTAG) developed a specification for boundary-scan testing that was standardized in 1990 as the IEEE Std. 1149.1-1990. In 1993 a new revision to the IEEE Std. 1149.1 standard was introduced (titled 1149.1a) and it contained many clarifications, corrections, and enhancements. In 1994, a supplement that contains a description of the boundary-scan Description Language (BSDL) was added to the standard.

 

Applications are found in high volume, high-end consumer products, telecommunication products, defense systems, computers, peripherals, and avionics.

 

 

Boundary-Scan Test Advantages

Stuck-at fault, Bridge fault 100% Detection

In-system-programming of PLD

Flash memory programming

To reduce Test preparation time-consuming Simple Test H/W

To reduce Test cost

Easy to find Fault Location

Concurrent Engineering

Easy to debug at the layout level

 

 

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